Encapsulation and Potting

Potting of electronics with

In standard or customer specific plastic or metal housing


Interconnects and Encapsulates Electronics


Thermoplastic moulding

A thermoplastic moulding done with a special moulding compound and customized moulding tools.



There are several reasons for encapsulation and potting of electronics. One of the biggest drivers is to achieve some kind of protection; environmental, chemical, moisture, mechanical, vibrations etc. It could also be that you have to reach a certain form factor or a function with your product.


You need to have all requirements mapped and good knowledge and experience in polymeric materials and encapsulation and potting processes in order to choose the right material and manufacturing process for your product. You also need to fully understand how polymeric materials behave and age when exposed to working conditions for you product. There are numerous parameters to take into consideration, if you fail one you might end up with a failing product.


MAK have 30+ years of experience working with encapsulation and potting processes. We do not have any standard products or materials; each project is unique and requires our full attention in order evaluate and develop a solution that will fulfill all requirements.


We can offer a turn-key solution and take your idea to a product with our experience and knowledge. MAK is independent and do not represent any brand of polymeric material, we choose the supplier and material that is best suited for your application.


The greater challenge the greater reason to choose MAK as your partner for your encapsulation and potting projects.



Customer specific solution

with special mould compounds developed to withstand abration extremely well.

Repacking adhesives

Repacking of adhesives into smaller production size packages.


M A Kapslingsteknik AB

MaskinvÀgen 6

746 30 BĂ„lsta


Copyright 2018 @ All Rights Reserved


Tel: 08 590 755 00

Fax: 08 36 64 46