DESIGN & ENGINEERING

Interconnects and Encapsulates Electronics

www.mak.se

MAK offers a range of design and engineering services to assist fabless semiconductor companies developing and bringing new products to the market. Together we can create a product based upon your ideas.

DESIGN:

MAK can develop and design packages to your meet your requirements and specifications, design and source substrates or lead frames and then complete the assembly process with your die, providing a complete turnkey solution, for packages such as:

• BGA

• MLF / MLP / QFN / DFN / LPCC

• Flip Chip

• Chip on Board

• Chip on Flex

• Custom Packages

We can also set up a reliability test plan for you product and also perform parts of the tests.

MAK can also

• Provide artwork support for marking

• Assist with generation of bonding diagrams.

ENGINEERING SERVICES:

We can also provide the following engineering services: