MAK offers a range of design and engineering services to assist fabless semiconductor companies developing and bringing new products to the market. Together we can create a product based upon your ideas.
MAK can develop and design packages to your meet your requirements and specifications, design and source substrates or lead frames and then complete the assembly process with your die, providing a complete turnkey solution, for packages such as:
• MLF / MLP / QFN / DFN / LPCC
• Flip Chip
• Chip on Board
• Chip on Flex
• Custom Packages
We can also set up a reliability test plan for you product and also perform parts of the tests.
MAK can also
• Provide artwork support for marking
• Assist with generation of bonding diagrams.
We can also provide the following engineering services:
• Process development
• Product development
• Project management
• Industrial engineering
• Courses and training
• Contract manufacturing
Contact us for more information.
M A Kapslingsteknik AB
746 30 Bålsta
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